Other

Advanced Semiconductor Engineering, Inc.

Ching-Ho Chang

Ching-Han Huang

An-Nong Wen

A semiconductor package includes a first die having a first surface, a first conductive bump over the first surface and having first height and a first width, a second conductive bump over the first surface and having a second height and a second width. The first width is greater than the second width and the first height is substantially identical to the second height. A method for manufacturing the semiconductor package is also provided.

Semiconductor package and method for manufacturing the same

An ornamental display includes a stand holding a plurality of lamps, bundles of optical glass fibers respectively fastened to the stands to pick up light from the lamps, a speaker, and a control IC controlled by a photoelectric switch and a sound-controlled switch to turn on the lamps in producing a lighting effect and the speaker in producing a sound effect when the intensity of ambient light drops below a predetermined value or, when a noise is produced.

Ornamental display with sound and lighting effect producing means

An improvement to windchimes is provided which comprises a supporting bracket. A cluster of chimes with different notes are hanged under the peripheral edge of the supporting bracket. Characterized in that an electric powered main pendulum is hanged under the center of the supporting bracket to play a preset melody or song. An auxiliary pendulum is hanged under the main pendulum. When the auxiliary pendulum is blown by the wind, a natural notes can be heard by the tinkling to the chimes.

Growing community of inventors

Kaohsiung, Taiwan

Ching-Ho Chang