Company Filing History:
Years Active: 2017-2021
Title: Chin-Te Wang: Innovator in Semiconductor Packaging Technology
Introduction
Chin-Te Wang is a prominent inventor based in Taipei, Taiwan. He has made significant contributions to the field of semiconductor packaging technology. With a total of 4 patents to his name, Wang continues to push the boundaries of innovation in his industry.
Latest Patents
One of Wang's latest patents focuses on the routing design of dummy metal caps and redistribution lines. This innovative package includes a first dielectric layer, a device die over and attached to the first dielectric layer, an active through-via, and a dummy through-via. An encapsulating material surrounds the device die, the active through-via, and the dummy through-via. The design also features a second dielectric layer that contacts the device die, the active through-via, and the dummy through-via. An active metal cap is positioned over the second dielectric layer, electrically coupling to the active through-via, while overlapping it. Additionally, a dummy metal cap is placed over the second dielectric layer, overlapping the dummy through-via. This dummy metal cap is divided into a first portion and a second portion by a gap, through which a redistribution line passes.
Career Highlights
Chin-Te Wang is currently employed at Taiwan Semiconductor Manufacturing Company Limited, a leading firm in the semiconductor industry. His work has been instrumental in advancing packaging technologies that enhance device performance and reliability.
Collaborations
Wang has collaborated with notable colleagues, including Hsien-Wei Chen and Wei-Cheng Wu, contributing to various projects that have furthered the field of semiconductor technology.
Conclusion
Chin-Te Wang's innovative work in semiconductor packaging technology exemplifies the spirit of invention and collaboration. His contributions continue to shape the future of the industry, making him a key figure in the field.