Chin-Te Chen is a prominent inventor based in Taichung Hsien, Taiwan. He has made significant contributions to the fields of circuit board structures and heat-dissipating technologies. With a total of 9 patents to his name, Chen continues to push the boundaries of innovation in his industry.

Latest Patents

Chen's latest patents include a groundbreaking circuit board structure and a method for fabricating the same. This invention involves a core board with conductive traces and solder pads, designed to enhance the efficiency of solder joints. The structure allows for multiple conductive traces to pass through adjacent solder pads, improving the overall functionality of circuit boards.

Another notable patent is the heat-dissipating structure and heat-dissipating semiconductor package. This invention features a chip carrier and a flip chip semiconductor chip, with a heat sink bonded via a thermal interface material. The design includes a groove on the heat sink to prevent the thermal interface material from wetting the groove during the bonding process, ensuring optimal thermal management.

Career Highlights

Chin-Te Chen is currently employed at Siliconware Precision Industries Co., Ltd., where he applies his expertise in semiconductor packaging and circuit design. His work has been instrumental in advancing the technology used in electronic devices.

Collaborations

Chen has collaborated with notable colleagues, including Chang-Fu Lin and Ming-Xun Lee. Their combined efforts have led to innovative solutions in the semiconductor industry.

Conclusion

Chin-Te Chen's contributions to circuit board and heat-dissipating technologies highlight his role as a leading inventor in Taiwan. His patents reflect a commitment to innovation and excellence in the field of electronics.

This text is generated by artificial intelligence and may not be accurate.

Please report any incorrect information to support@idiyas.com