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Taichung Hsien, Taiwan

Chin-Te Chen

USPTO Granted Patents = 9

Average Co-Inventor Count = 2.6

ph-index = 6

Forward Citations = 203(Granted Patents)

Location History:

Miaoli Hsien, TW (2002)
Taichung, TW (2005)
Taichung Hsien, TW (2001 - 2011)

Company Filing History:

Siliconware Precision Industries Co., Ltd.

Years Active: 2001-2011

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9 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 7999189 - Circuit board structure and method for fabricating the same (2011-08-16),

2. 7863731 - Heat-dissipating structure and heat-dissipating semiconductor package having the same (2011-01-04),

3. 7203072 - Heat dissipating structure and semiconductor package with the same (2007-04-10),

4. 6980438 - Semiconductor package with heat dissipating structure (2005-12-27),

5. 6670219 - Method of fabricating a CDBGA package (2003-12-30),

6. 6515361 - Cavity down ball grid array (CD BGA) package (2003-02-04),

7. 6441501 - Wire-bonded semiconductor device with improved wire arrangement scheme for minimizing abnormal wire sweep (2002-08-27),

8. 6388313 - Multi-chip module (2002-05-14),

9. 6264535 - Wafer sawing/grinding process (2001-07-24),

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