Tainan, Taiwan

Chin-Nan Wu


Average Co-Inventor Count = 3.1

ph-index = 3

Forward Citations = 18(Granted Patents)


Location History:

  • Ilan, TW (2005)
  • Tainan, TW (2006 - 2020)

Company Filing History:


Years Active: 2005-2020

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6 patents (USPTO):Explore Patents

Title: The Innovations of Chin-Nan Wu

Introduction

Chin-Nan Wu is a prominent inventor based in Tainan, Taiwan. He has made significant contributions to the field of image sensor technology, holding a total of six patents. His work focuses on enhancing the performance and efficiency of backside illumination (BSI) image sensors.

Latest Patents

Wu's latest patents include innovative methods for surface treatment of BSI image sensors. One method involves forming an image sensor adjacent to a first side of a substrate, thinning the second side of the substrate, performing a halogen treatment on the second side, and forming a backside illumination layer on that side. Another patent describes a process where ions are implanted in a substrate to create multiple photodiodes, followed by the formation of an interconnect layer over the first side and applying a halogen treatment to the second side, resulting in a silicon-halogen compound layer.

Career Highlights

Throughout his career, Chin-Nan Wu has worked with notable companies such as Taiwan Semiconductor Manufacturing Company Ltd. and Elan Microelectronics Corporation. His experience in these organizations has allowed him to develop and refine his innovative techniques in semiconductor technology.

Collaborations

Wu has collaborated with several talented individuals in his field, including Shiu-Ko JangJian and Chun Che Lin. These partnerships have contributed to the advancement of his research and the successful development of his patents.

Conclusion

Chin-Nan Wu's contributions to the field of image sensor technology are noteworthy. His innovative patents and collaborations reflect his dedication to advancing semiconductor technology. His work continues to influence the industry and inspire future innovations.

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