Company Filing History:
Years Active: 2009-2011
Title: Chin-Jen Huang: Innovator in Thermal Resistive Technologies
Introduction
Chin-Jen Huang is a prominent inventor based in Kaohsiung, Taiwan. He has made significant contributions to the field of thermal resistive technologies, holding a total of 4 patents. His work focuses on innovative methods and structures that enhance the performance and durability of electronic devices.
Latest Patents
Huang's latest patents include a groundbreaking invention titled "Structure of thermal resistive layer and the method of forming the same." This invention discloses a structure of thermal resistive layers formed on a plastic substrate. The design includes a porous layer made up of a plurality of oxides with a hollow structure, along with a buffer layer that protects the plastic substrate from heat damage during manufacturing. This innovation facilitates the production of thin film transistors and electronic devices on plastic substrates using Low Temperature PolySilicon (LTPS) technology without altering any parameters.
Another notable patent is the "Method for fabricating flexible pixel array substrate." In this method, a release layer is first formed on a rigid substrate, followed by the application of a polymer film. The polymer film is created through spin coating a polymer monomer and curing it to form a solid layer. A pixel array is then formed on this polymer film, which is subsequently separated from the rigid substrate, allowing for the creation of flexible electronic devices.
Career Highlights
Chin-Jen Huang is affiliated with the Industrial Technology Research Institute, where he continues to push the boundaries of technology through his innovative research and development efforts. His work has been instrumental in advancing the capabilities of flexible electronics and thermal management solutions.
Collaborations
Huang collaborates with esteemed colleagues such as Jung-Fang Chang and Yu-Hung Chen, contributing to a dynamic research environment that fosters innovation and technological advancement.
Conclusion
Chin-Jen Huang's contributions to thermal resistive technologies and flexible electronics exemplify the spirit of innovation. His patents not only enhance the manufacturing processes of electronic devices but also pave the way for future advancements in the field.