This inventor holds 1 USPTO granted patent. Top assignee: Macronix International Co., Ltd.. Active years: 2005.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2005
Title: Innovations by Chin Hsiang Lin
Introduction
Chin Hsiang Lin is a notable inventor based in Nantou, Taiwan. He has made significant contributions to the field of semiconductor fabrication. His innovative approach has led to the development of a unique method that enhances the efficiency of shallow trench isolation regions.
Latest Patents
Chin Hsiang Lin holds a patent for a "Fabrication method for shallow trench isolation region." This method involves a detailed process where a part of the trench is initially filled with a first insulation layer. Following this, a surface treatment process is performed to create a surface treated layer on the first insulation layer. The surface treated layer is then removed, and a second insulation layer is formed on the first insulation layer, filling the trench to establish a shallow trench isolation region. This innovative approach effectively reduces the aspect ratio of the trench before the second insulation filling, thereby preventing issues such as void formation due to high aspect ratios.
Career Highlights
Chin Hsiang Lin is currently associated with Macronix International Co., Ltd., where he continues to apply his expertise in semiconductor technology. His work has been instrumental in advancing the company's capabilities in the fabrication of semiconductor devices.
Collaborations
Chin Hsiang Lin has collaborated with notable colleagues, including Kuang-Chao Chen and Chin-Wei Liao. These collaborations have fostered a productive environment for innovation and development within their field.
Conclusion
Chin Hsiang Lin's contributions to semiconductor fabrication through his innovative patent demonstrate his commitment to advancing technology. His work not only enhances the efficiency of fabrication methods but also sets a precedent for future innovations in the industry.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
