Company Filing History:
Years Active: 2024-2025
Title: Innovations of Chin-chou Liu
Introduction
Chin-chou Liu is a prominent inventor based in Hsinchu County, Taiwan. He has made significant contributions to the field of semiconductor technology, holding a total of five patents. His work focuses on advanced chip architectures and thermoelectric cooling systems, which are crucial for enhancing the performance and efficiency of integrated circuits.
Latest Patents
One of Liu's latest patents is for a SOIC chip architecture. This innovative device includes an interconnection device die and at least two additional device dice. The additional device dies can be system on integrated chip (SOIC) dies laying face to face (F2F) on the interconnection device die. The interconnection device die features electrical connectors on one surface, enabling connections to and among the additional device dice. It also includes at least one redistribution circuit structure, which may be an integrated fan out (InFO) structure, and at least one through-silicon via (TSV). The TSV facilitates connections between signal lines, power lines, or ground lines from the opposite surface of the interconnection device die to the redistribution circuit structure and/or electrical connectors. Notably, at least one of the additional dice can be a three-dimensional integrated circuit (3DIC) die with face to back (F2B) stacking.
Another significant patent by Liu involves thermoelectric cooling of semiconductor devices. This integrated circuit (IC) device comprises a
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