The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 04, 2024
Filed:
Jul. 12, 2022
Taiwan Semiconductor Manufacturing Company Ltd., Hsinchu, TW;
Jung-Chou Tsai, Hsinchu, TW;
Fong-Yuan Chang, Hsinchu County, TW;
Po-Hsiang Huang, Tainan, TW;
Chin-Chou Liu, Hsinchu County, TW;
Yi-Kan Cheng, Taipei, TW;
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD., Hsinchu, TW;
Abstract
An interconnect structure includes a plurality of first pads arranged to form a first array and a plurality of second pads arranged to form a second array. Each of the first array has a first row, a second row and an mrow extending along a first direction and parallel to each other along a second direction. The first pads in each of the first row, the second row and the mrow are grouped into a first group, a second group and an ngroup extending along the second direction. The second pads in each of the first row, the second row and the mrow are grouped into a first group, a second group and an ngroup extending along the second direction. The interconnect structure further includes a plurality of first conductive lines, a plurality of second conductive lines and a plurality of nconductive lines.