Chii Ming Wu

Title: Chii Ming Wu: Innovator in Integrated Chip Technology

Introduction: Chii Ming Wu is a notable inventor based in Taipei, Taiwan. He has made significant contributions to the field of integrated chip technology. His innovative work has led to the development of a unique patent that enhances the functionality of integrated circuits.

Latest Patents: Chii Ming Wu holds a patent for a "Film structure for bond pad." This patent describes an integrated chip that includes an interconnect structure over a substrate. The interconnect structure features multiple interconnect layers within a dielectric structure. A bond pad structure is positioned over the interconnect structure, which includes a contact layer. A first masking layer made of metal-oxide is placed over the bond pad structure, defining an opening with interior sidewalls directly above the bond pad. A conductive bump is arranged within this opening and on the contact layer. This innovation is crucial for improving the performance and reliability of integrated circuits.

Career Highlights: Chii Ming Wu is associated with Taiwan Semiconductor Manufacturing Company Limited, a leading firm in the semiconductor industry. His work at this company has allowed him to contribute to cutting-edge technologies in chip manufacturing.

Collaborations: Chii Ming Wu has collaborated with talented coworkers, including Julie Yang and Tzu-Chung Tsai. Their combined expertise has fostered an environment of innovation and advancement in their projects.

Conclusion: Chii Ming Wu's contributions to integrated chip technology through his patent and work at Taiwan Semiconductor Manufacturing Company Limited highlight his role as a significant inventor in the field. His innovative spirit continues to drive advancements in semiconductor technology.