This inventor holds 2 USPTO granted patents. Top assignee: Siliconware Precision Industries Co., Ltd.. Active years: 2001-2002.
Company Filing History:
Years Active: 2001-2002
Title: Innovations of Chih-Tsung Hou in Semiconductor Packaging
Introduction
Chih-Tsung Hou is a notable inventor based in Taichung, Taiwan. He has made significant contributions to the field of semiconductor packaging, holding 2 patents that showcase his innovative approach to enhancing the efficiency and reliability of integrated circuit packages.
Latest Patents
One of his latest patents is titled "Structure of disturbing plate having down set." This invention involves a disturbing plate structure that includes at least one down set, which is applicable in a lead frame-type package in a semiconductor. The design incorporates a lead frame, a die, a glue layer, multiple disturbing plates, and both top and bottom mold compounds. The configuration allows for two disturbing plates to be positioned on either side of the die, creating a space through the bending of specific portions of the disturbing plate. This innovation ensures that the lead frame is effectively encapsulated with a mold compound, optimizing the packaging process.
Another significant patent by Chih-Tsung Hou is the "Method of forming a constricted-mouth dimple structure on a leadframe die pad." This method enhances the security of the molded compound in an integrated circuit package by utilizing a stamping process to narrow the mouth of an inwardly-tapered dimple structure. This approach not only improves the reliability of the package by reducing the likelihood of delamination but also offers a more cost-effective solution compared to previous methods.
Career Highlights
Chih-Tsung Hou is currently employed at Siliconware Precision Industries Co., Ltd., a leading company in the semiconductor industry. His work focuses on developing innovative packaging solutions that address common challenges in the field.
Collaborations
He has collaborated with talented coworkers such as Ya-Yi Lai and Yueh-Chiung Chang, contributing to a dynamic team that drives advancements in semiconductor technology.
Conclusion
Chih-Tsung Hou's contributions to semiconductor packaging through his innovative patents demonstrate his expertise and commitment to improving technology in this field. His work continues to influence the industry and pave the way for future advancements.