The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 25, 2001
Filed:
Jan. 27, 2000
Chih-Tsung Hou, Taichung Hsien, TW;
Kun Ming Huang, Changhwa, TW;
Abstract
A method is proposed for forming a constricted-mouth dimple structure on a lead-frame die pad for an integrated circuit (IC) package. This method can help secure the molded compound of the integrated circuit package more firmly in position to the die pad so that the molded compound would be less likely subjected to delamination. This method is charaterized in the use of a stamping process to punch on a selected part of the die pad that is located around the mouth of an originally-formed inwardly-tapered dimple structure, thereby narrowing the mouth of the inwardly-tapered dimple structure, resulting in the forming of the intended constricted-mouth dimple structure. Since this method requires only an additional stamping process to narrow the originally-formed inwardly-tapered dimple structure, it is much easier and more cost-effective to implement than the prior art.