Chih-ting Lai

Title: Chih-ting Lai and Semiconductor Packaging Innovation.

Introduction

Chih-ting Lai is an inventor associated with Hsinchu, Taiwan, and Taiwan Semiconductor Manufacturing Company Limited. His patent work concerns semiconductor packaging and manufacturing methods.

Latest Patents

The provided information lists one patent for Lai: “Semiconductor Package and Manufacturing Method Thereof.” The invention describes a semiconductor package with a first redistribution structure, a semiconductor die, and a stack of composite conductive structures, all covered in part by insulating encapsulation. The stack has lower and upper tiers, each comprising a support layer, through-material vias that penetrate the support layer, and a conductive adhesive member beneath the support layer and vias. The patent presents a packaging structure and a method for manufacturing it. Lai’s listed patent count is 1 patent.

Career Highlights

Lai’s listed work connects his inventive activity with semiconductor manufacturing at Taiwan Semiconductor Manufacturing Company Limited. The patent focuses on integrating semiconductor dies and tiered conductive structures within an encapsulated package.

Collaborations

Hsin-Yu Pan is identified as Lai’s coworker. The provided information does not specify whether Pan collaborated on the patent.

Conclusion

Chih-ting Lai’s listed patent addresses semiconductor packaging through a tiered composite conductive structure and its manufacturing method, reflecting an innovation relevant to advanced chip integration.