Ciaotou, Taiwan

Chih-Min Pao

This inventor holds 2 USPTO granted patents. Top assignee: Advanced Semiconductor Engineering, Inc.. Active years: 2004-2005.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Chih-Min Pao. Retrieved from https://idiyas.com/inventor/chih-min-pao

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 4.0

ph-index = 2

Forward Citations = 63(Granted Patents)


Location History:

  • Kaoshiung, TW (2004)
  • Ciaotou, TW (2005)

Company Filing History:


Years Active: 2004-2005

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2 patents (USPTO):Explore Patents

Title: Chih-Min Pao: Innovator in Semiconductor Packaging

Introduction

Chih-Min Pao is a notable inventor based in Ciaotou, Taiwan. He has made significant contributions to the field of semiconductor packaging, holding a total of 2 patents. His work focuses on innovative solutions that enhance the efficiency and reliability of semiconductor devices.

Latest Patents

One of Chih-Min Pao's latest patents is titled "Package structure with a heat spreader and manufacturing method thereof." This invention discloses a package structure that includes a substrate, a ground pad, a heat spreader, a non-conductive adhesive layer, and a pre-solder layer. The manufacturing method involves several steps, including providing the substrate, forming the pre-solder layer, and disposing the heat spreader onto the non-conductive layer. This innovative approach ensures that the heat spreader is effectively adhered to the substrate, enhancing thermal management in semiconductor applications.

Another significant patent is for a "semiconductor wafer cassette." This cassette features a body that defines an internal bay portion with slots for vertically receiving wafers. Each slot is supported by a slab, and the cassette is designed with parallel legs for stability and a handle for ease of handling. This invention is crucial for the efficient storage and transport of semiconductor wafers.

Career Highlights

Chih-Min Pao is currently employed at Advanced Semiconductor Engineering, Inc., where he continues to develop cutting-edge technologies in semiconductor packaging. His expertise and innovative mindset have positioned him as a valuable asset in the industry.

Collaborations

Chih-Min has collaborated with notable colleagues, including Chi-Ta Chuang and Chien Cheng Liu. Their combined efforts contribute to the advancement of semiconductor technologies and innovations.

Conclusion

Chih-Min Pao's contributions to semiconductor packaging through his patents and work at Advanced Semiconductor Engineering, Inc. highlight his role as a key innovator in the field. His inventions not only improve the performance of semiconductor devices but also pave the way for future advancements in technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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