The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 22, 2005
Filed:
Jun. 18, 2004
Chi-ta Chuang, Kaohsiung, TW;
Chih-min Pao, Ciaotou, TW;
Chien Liu, Kaohsiung, TW;
Chi-hao Chiu, Pingtung, TW;
Chi-Ta Chuang, Kaohsiung, TW;
Chih-Min Pao, Ciaotou, TW;
Chien Liu, Kaohsiung, TW;
Chi-Hao Chiu, Pingtung, TW;
Advanced Semiconductor Engineering, Inc., Kaohsiung, TW;
Abstract
A package structure with a heat spreader and manufacturing method thereof is disclosed. The package structure includes a substrate, a ground pad, a heat spreader, a non-conductive adhesive layer, and a pre-solder layer. A die is seated on the substrate, and the ground pad is disposed on the surface of the substrate. The manufacturing method of the package structure includes the following steps: (a) providing the substrate; (b) forming the pre-solder layer on the ground pad by solder paste printing; (c) forming the non-conductive adhesive layer on the substrate surface for being adjacent to the pre-solder layer by adhesive dispensing; (d) disposing the heat spreader onto the non-conductive layer and the pre-solder layer; and (e) heating the non-conductive adhesive layer for solidification and continuing to heat the pre-solder layer for solder reflow so that the heat spreader is adhered to the substrate via the non-conductive adhesive layer and coupled to the ground pad via the pre-solder layer.