This inventor holds 2 USPTO granted patents and 6 published patent applications. Top assignees: Taiwan Semiconductor Manufacturing Co., Ltd., Taiwan Semiconductor Manufacturing Comp. Ltd.. Active years: 2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
1 out of 491 
1 out of 42,926 
Years Active: 2026
Title: Chih-Han Tseng: Innovator in Semiconductor Technology
Introduction
Chih-Han Tseng is a notable inventor based in Tainan, Taiwan. He has made significant contributions to the field of semiconductor technology, focusing on innovative methods for enhancing interconnect structures. Although he currently holds no granted patents, his work is paving the way for future advancements in the industry.
Latest Patent Applications
Chih-Han Tseng's latest patent applications include two significant innovations. The first application, titled "SELECTIVE METAL CAP IN AN INTERCONNECT STRUCTURE," describes a method that involves forming an opening in a dielectric layer to expose a metal feature. This method includes selectively depositing a metal cap on the metal feature, followed by the deposition of a barrier layer over the metal cap, and finally depositing a conductive fill on the barrier layer.
The second application, "LOW CONTACT RESISTANCE VIAS IN BACKEND INTERCONNECT STRUCTURES," outlines a method for forming a semiconductor device. This process includes forming a via in a first dielectric layer over a substrate, followed by the formation of a second dielectric layer over the first. An opening is created in the second dielectric layer to expose the upper surface of the via. A capping layer is then selectively formed over the upper surface of the via, which has a curved upper surface extending above the first upper surface of the first dielectric layer. After forming the capping layer, a barrier layer is created in the opening over the capping layer and along the sidewalls of the second dielectric layer. The opening is filled by forming an electrically conductive material over the barrier layer.
Conclusion
Chih-Han Tseng is an innovative inventor whose work in semiconductor technology is noteworthy. His latest patent applications demonstrate his commitment to advancing the field, even in the absence of granted patents. His contributions are expected to influence future developments in semiconductor interconnect structures.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile