Zhudong, Taiwan

Chih-Chun Chiu

USPTO Granted Patents = 2 

Average Co-Inventor Count = 6.0

ph-index = 1

Forward Citations = 2(Granted Patents)


Company Filing History:


Years Active: 2014-2025

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2 patents (USPTO):Explore Patents

Title: Innovations by Chih-Chun Chiu

Introduction

Chih-Chun Chiu is a notable inventor based in Zhudong, Taiwan. He has made significant contributions to the field of semiconductor technology, holding 2 patents that showcase his innovative spirit and technical expertise.

Latest Patents

One of his latest patents is a "Semiconductor storage apparatus with integrated sorter." This invention involves an apparatus, system, and method for storing die carriers and transferring a semiconductor die between the die carriers. The die stocker includes a rack enclosure with an integrated sorting system. The rack enclosure features storage cells designed to receive and store die carriers with different physical configurations. A transport system is employed to move the first and second die carriers between a first plurality of storage cells and a first sorter load port, introducing them to a first sorter. Similarly, the transport system also moves third and fourth die carriers between a second plurality of storage cells and a second sorter load port, where they are introduced to a second sorter. The first and second die carriers possess a first physical configuration, while the third and fourth die carriers have a second physical configuration that differs from the first.

Another significant patent is the "Method and apparatus for reducing package warpage." This invention provides mechanisms for flattening a packaged structure. The mechanisms include a flattening apparatus and the use of protection layers between the packaged structure and the surfaces of the flattening apparatus. These protection layers are made from a soft and non-sticking material, which helps protect fragile elements of the packaged structure and allows for easy separation after processing. The flattening process involves applying pressure under elevated processing temperatures to effectively flatten the warped packaged structure within a reasonable processing time.

Career Highlights

Chih-Chun Chiu is currently employed at Taiwan Semiconductor Manufacturing Company Limited, a leading firm in the semiconductor industry. His work has contributed to advancements in semiconductor storage and packaging technologies.

Collaborations

Chih-Chun has collaborated with notable colleagues, including Meng-Tse Chen and Hui-Min Huang, who have also made significant contributions to the field.

Conclusion

Chih-Chun Chiu's innovative patents and contributions to semiconductor technology highlight his role as a key inventor in the industry. His work continues to influence advancements in semiconductor storage and packaging solutions.

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