The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 04, 2014
Filed:
May. 21, 2012
Meng-tse Chen, Changzhi Township, TW;
Hui-min Huang, Taoyuan, TW;
Chun-cheng Lin, New Taipei, TW;
Chih-chun Chiu, Zhudong Township, TW;
Ming-da Cheng, Jhubei, TW;
Chung-shi Liu, Hsinchu, TW;
Meng-Tse Chen, Changzhi Township, TW;
Hui-Min Huang, Taoyuan, TW;
Chun-Cheng Lin, New Taipei, TW;
Chih-Chun Chiu, Zhudong Township, TW;
Ming-Da Cheng, Jhubei, TW;
Chung-Shi Liu, Hsinchu, TW;
Abstract
Embodiments of mechanisms for flattening a packaged structure are provided. The mechanisms involve a flattening apparatus and the utilization of protection layer(s) between the packaged structure and the surface(s) of the flattening apparatus. The protection layer(s) is made of a soft and non-sticking material to allow protecting exposed fragile elements of the packaged structure and easy separation after processing. The embodiments of flattening process involve flattening the warped packaged structure by pressure under elevated processing temperature. Processing under elevated temperature allows the package structure to be flattened within a reasonable processing time.