Taichung, Taiwan

Chih-Chiang He

This inventor holds 3 USPTO granted patents and 10 published patent applications. Top assignee: Siliconware Precision Industries Co., Ltd.. Active years: 2020-2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Chih-Chiang He. Retrieved from https://idiyas.com/inventor/chih-chiang-he

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 3 

% Patents Active = 100.0

Average Co-Inventor Count = 3.5

ph-index = 1

Forward Citations = 3(Granted Patents)


Company Filing History:


Years Active: 2020-2025

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3 patents (USPTO):Explore Patents

Title: Innovations by Chih-Chiang He in Electronic Packaging

Introduction

Chih-Chiang He is a notable inventor based in Taichung, Taiwan. He has made significant contributions to the field of electronic packaging, holding 3 patents that focus on innovative methods for fabricating electronic packages. His work is instrumental in reducing manufacturing costs and improving the efficiency of electronic components.

Latest Patents

Chih-Chiang He's latest patents include a method for fabricating electronic packages with conductive pillars. This method involves providing a metal member that includes a supporting plate and a plurality of conductive pillars. A circuit structure is coupled to these conductive pillars, and an electronic component is disposed on the metal member, electrically connected to the circuit structure. An encapsulant encapsulates both the conductive pillars and the electronic component. The supporting plate is then removed, allowing for the use of any mold for fabricating the electronic package, regardless of its size. This innovation significantly reduces the fabrication cost of electronic packages.

Another patent by Chih-Chiang He describes an electronic package with conductive pillars. Similar to his previous patent, this electronic package consists of a metal member with a supporting plate and conductive pillars. The circuit structure is coupled to the conductive pillars, and an electronic component is placed on the metal member, connected to the circuit structure. The encapsulant encapsulates the conductive pillars and the electronic component, ensuring durability and functionality. This design also allows for cost-effective manufacturing.

Career Highlights

Chih-Chiang He is currently employed at Siliconware Precision Industries Co., Ltd. His work at this company has allowed him to further develop his innovative ideas in electronic packaging. His contributions have been recognized within the industry, showcasing his expertise and commitment to advancing technology.

Collaborations

Chih-Chiang He has collaborated with notable coworkers, including Chih-Hsien Chiu and Chia-Yang Chen. These collaborations have fostered a creative environment that encourages innovation and the development of new technologies in electronic packaging.

Conclusion

Chih-Chiang He is a prominent inventor whose work in electronic packaging has led to significant advancements in the field. His patents not only enhance the efficiency of electronic components but also contribute to cost-effective manufacturing processes. His ongoing contributions continue to shape the future of electronic packaging technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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