Chien-Ming Wang

Title: Chien-Ming Wang: Innovator in Wafer Processing Technologies

Introduction

Chien-Ming Wang is a notable inventor based in Tainan, Taiwan. He has made significant contributions to the field of semiconductor manufacturing, particularly in the area of wafer processing technologies. With a total of 2 patents to his name, Wang's innovations are paving the way for advancements in the industry.

Latest Patents

Wang's latest patents focus on bevel edge removal methods, tools, and systems. One of his inventions is a tool designed for removing films from the bevel regions of wafers. This bevel film removal tool features an inner motor nested within an outer motor, along with a bevel brush secured to the outer motor. The bevel brush can be adjusted radially outward to allow the wafer to be inserted and secured to the inner motor. Additionally, it can be adjusted radially inward to engage specific sections of the brush, bringing it into contact with the wafer's bevel region. Once engaged, a solution can be dispensed at the engaged sections, and both motors can be rotated to facilitate the chemical and mechanical removal of bevel films from the wafer.

Career Highlights

Chien-Ming Wang is currently employed at Taiwan Semiconductor Manufacturing Company Limited, a leading player in the semiconductor industry. His work there has allowed him to apply his innovative ideas and contribute to the company's success in wafer processing technologies.

Collaborations

Wang has collaborated with several talented individuals in his field, including Hui-Chi Huang and Jeng-Chi Lin. These collaborations have further enhanced his work and contributed to the development of advanced technologies in semiconductor manufacturing.

Conclusion

Chien-Ming Wang is a prominent inventor whose work in wafer processing technologies is making a significant impact in the semiconductor industry. His innovative patents and collaborations reflect his dedication to advancing the field.