Chien-Lung Chuang

Title: Innovations of Chien-Lung Chuang in Packaging Substrate Technology.

Introduction

Chien-Lung Chuang is a notable inventor based in Taichung, Taiwan. He has made significant contributions to the field of packaging substrate technology. His innovative approach has led to the development of a unique fabrication method that addresses common challenges in the industry.

Latest Patents

Chuang holds a patent for a "Fabrication method of packaging substrate." This invention includes a packaging substrate that features a base body with at least one conductive pad on its surface. A dielectric layer is formed on the surface of the base body, which has at least one first opening to expose the conductive pad and a second opening at the periphery of the first opening. Additionally, a metal layer is formed on both the conductive pad and the dielectric layer, extending to the sidewall of the second opening. This design effectively eliminates side-etching of the metal layer under a solder bump, enhancing the reliability of the packaging substrate.

Career Highlights

Chien-Lung Chuang is currently employed at Siliconware Precision Industries Co., Ltd. His work at this esteemed company has allowed him to focus on advancing packaging technologies. His innovative contributions have positioned him as a key figure in the field.

Collaborations

Chuang has collaborated with talented coworkers, including Po-Yi Wu and Meng-Tsung Lee. Their combined expertise has fostered a productive environment for innovation and development.

Conclusion

Chien-Lung Chuang's contributions to packaging substrate technology exemplify the impact of innovative thinking in the industry. His patent reflects a significant advancement that addresses critical challenges in the field.