Siliconware Precision Industries Co., Ltd.

Chien-Lung Chuang

Meng-Tsung Lee

Yih-Jenn Jiang

Po-Yi Wu

A packaging substrate includes a base body having at least a conductive pad on a surface thereof, a dielectric layer formed on the surface of the base body and having at least a first opening for exposing the conductive pad and at least a second opening formed at a periphery of the first opening, and a metal layer formed on the conductive pad and the dielectric layer and extending to a sidewall of the second opening, thereby effectively eliminating side-etching of the metal layer under a solder bump.

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Taichung, Taiwan

Chien-Lung Chuang