Company Filing History:
Years Active: 2014-2015
Title: Chien-Lin Tseng: Innovator in Semiconductor Technology
Introduction
Chien-Lin Tseng is a prominent inventor based in Zhubei, Taiwan. He has made significant contributions to the field of semiconductor technology, holding a total of 2 patents. His innovative approaches have advanced the methods used in semiconductor manufacturing.
Latest Patents
One of his latest patents is titled "Method to form multiple trenches utilizing a grayscale mask." This patent describes a method for creating multiple openings within a substrate using a single photo exposure and etch process. The process involves aligning a photoresist layer with a photomask that contains transparent, grayscale, and opaque areas. By exposing the photomask and substrate to radiation in a single illumination step, a 3-dimensional pattern is formed, allowing for openings of varying depths to be created efficiently.
Another notable patent is "Shallow via formation by oxidation." This invention outlines a method and apparatus for constructing shallow recessed wells on exposed conductive vias on a semiconductor surface. These wells are filled with a conductive cap layer, such as tantalum nitride (TaN), to mitigate oxidation risks that may occur when exposed to air or during metallization processes.
Career Highlights
Chien-Lin Tseng is currently employed at Taiwan Semiconductor Manufacturing Company Limited, a leading firm in the semiconductor industry. His work has been instrumental in enhancing manufacturing techniques and improving the reliability of semiconductor devices.
Collaborations
Throughout his career, Tseng has collaborated with notable colleagues, including Lin-Ya Huang and Chi-Sheng Juan. These partnerships have fostered innovation and contributed to the advancement of semiconductor technologies.
Conclusion
Chien-Lin Tseng's contributions to semiconductor technology through his patents and collaborations highlight his role as a key innovator in the field. His work continues to influence the industry and pave the way for future advancements.