Chien Lin Liu

Title: Innovations of Chien Lin Liu in 3D Integrated Circuits

Introduction

Chien Lin Liu is a notable inventor based in Kaohsiung, Taiwan. He has made significant contributions to the field of integrated circuits, particularly in the area of three-dimensional (3D) IC technology. His innovative work has led to the development of a unique patent that enhances the functionality and efficiency of 3D integrated circuits.

Latest Patents

Chien Lin Liu holds a patent for a "Shared pad/bridge layout for a 3D IC." This patent describes various embodiments directed towards a shared frontside pad/bridge layout for a 3D integrated circuit. The invention includes a second IC die that underlies the first IC die, and a third IC die that underlies the second IC die. The layout features a first-die backside pad, a second-die backside pad, and a third-die backside pad arranged in a row, which overlie the respective IC dies. These pads are electrically coupled to individual semiconductor devices of the IC dies, facilitating efficient lateral routing for electrical connections.

Career Highlights

Chien Lin Liu is currently employed at Taiwan Semiconductor Manufacturing Company Limited, a leading firm in the semiconductor industry. His work at this company has allowed him to collaborate with other talented professionals in the field, further advancing the technology of integrated circuits.

Collaborations

Chien Lin Liu has worked alongside notable colleagues such as Harry-Hak-Lay Chuang and Wei-Cheng Wu. Their combined expertise has contributed to the successful development of innovative technologies in the semiconductor sector.

Conclusion

Chien Lin Liu's contributions to the field of 3D integrated circuits exemplify the importance of innovation in technology. His patent for a shared pad/bridge layout represents a significant advancement in the design and functionality of integrated circuits.