Chien-Huang Yeh

Title: Chien-Huang Yeh: Innovator in Semiconductor Device Packaging

Introduction

Chien-Huang Yeh is a prominent inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of semiconductor device packaging, holding a total of 3 patents. His work focuses on enhancing the performance and reliability of semiconductor devices.

Latest Patents

One of Chien-Huang Yeh's latest patents involves shielding structures for semiconductor device packages. This innovative semiconductor device package includes a substrate with a first region, a passive device placed over this region, and a contact pad situated above the passive device. A passivation layer is applied over the contact pad, which features a recess that exposes the contact pad. The under-bump metallization (UBM) layer consists of an upper portion above the passivation layer and a lower portion on the sidewall of the recess. Notably, the projection of the upper portion of the UBM layer, when viewed perpendicularly to the substrate, falls within the area of the contact pad.

Career Highlights

Chien-Huang Yeh is associated with Taiwan Semiconductor Manufacturing Company Limited, a leading player in the semiconductor industry. His expertise in semiconductor packaging has positioned him as a valuable asset in the field.

Collaborations

Chien-Huang Yeh has collaborated with notable colleagues, including Chih-Fan Huang and Hui-Chi Chen. Their combined efforts contribute to advancements in semiconductor technology.

Conclusion

Chien-Huang Yeh's innovative work in semiconductor device packaging exemplifies his commitment to enhancing technology in the semiconductor industry. His patents reflect a deep understanding of the complexities involved in semiconductor design and manufacturing.