Taiwan Semiconductor Manufacturing Comp. Ltd.

Chien-Huang Yeh

Yen-Ming Chen

Dian-Hau Chen

Chih-Fan Huang

Hui-Chi Chen

Kuo-Chin Chang

Hong-Seng Shue

Semiconductor device packages and method are provided. A semiconductor device package according to the present disclosure includes a substrate including a first region, a passive device disposed over the first region of the substrate, a contact pad disposed over the passive device, a passivation layer disposed over the contact pad, a recess through the passivation layer, and an under-bump metallization (UBM) layer. The recess exposes the contact pad and the UBM layer includes an upper portion disposed over the passivation layer and a lower portion disposed over a sidewall of the recess. A projection of the upper portion of the UBM layer along a direction perpendicular to the substrate falls within an area of the contact pad.

Growing community of inventors

Hsinchu, Taiwan

Chien-Huang Yeh