Chien-Hao Chen

Title: Innovations by Chien-Hao Chen in Semiconductor Technology

Introduction

Chien-Hao Chen is a notable inventor based in Kaohsiung, Taiwan. He has made significant contributions to the field of semiconductor technology, holding three patents that showcase his innovative approach to device packaging.

Latest Patents

Chien-Hao Chen's latest patents include a semiconductor device package that features a substrate, a connection structure, a first package body, and a first electronic component. The substrate has a first surface and a second surface opposite to the first surface. The connection structure is disposed on the first surface of the substrate. The first package body is placed on the first surface of the substrate, covering the connection structure while exposing a portion of it. The first electronic component is then positioned on the first package body, making contact with the exposed portion of the connection structure. Another patent focuses on the method of manufacturing the same semiconductor device package, emphasizing the innovative design and functionality of the components involved.

Career Highlights

Chien-Hao Chen is currently employed at Advanced Semiconductor Engineering, Inc., where he continues to develop cutting-edge technologies in semiconductor packaging. His work has been instrumental in advancing the efficiency and reliability of electronic components.

Collaborations

Chien-Hao Chen collaborates with talented coworkers such as Shang-Ruei Wu and Chien-Yuan Tseng, contributing to a dynamic team that drives innovation in their field.

Conclusion

Chien-Hao Chen's contributions to semiconductor technology through his patents and work at Advanced Semiconductor Engineering, Inc. highlight his role as a key innovator in the industry. His advancements in semiconductor device packaging are paving the way for future developments in electronics.