The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 30, 2024
Filed:
Oct. 04, 2021
Advanced Semiconductor Engineering, Inc., Kaohsiung, TW;
Shang-Ruei Wu, Kaohsiung, TW;
Chien-Yuan Tseng, Kaohsiung, TW;
Meng-Jen Wang, Kaohsiung, TW;
Chen-Tsung Chang, Kaohsiung, TW;
Chih-Fang Wang, Kaohsiung, TW;
Cheng-Han Li, Kaohsiung, TW;
Chien-Hao Chen, Kaohsiung, TW;
An-Chi Tsao, Kaohsiung, TW;
Per-Ju Chao, Kaohsiung, TW;
ADVANCED SEMICONDUCTOR ENGINEERING, INC., Kaohsiung, TW;
Abstract
A semiconductor device package includes a substrate, a connection structure, a first package body and a first electronic component. The substrate has a first surface and a second surface opposite to the first surface. The connection structure is disposed on the firs surface of the substrate. The first package body is disposed on the first surface of the substrate. The first package body covers the connection structure and exposes a portion of the connection structure. The first electronic component is disposed on the first package body and in contact with the portion of the connection structure exposed by the first package body.