Company Filing History:
Years Active: 2021-2025
Title: Innovations of Chih-Fang Wang in Semiconductor Technology
Introduction
Chih-Fang Wang is a notable inventor based in Kaohsiung, Taiwan. He has made significant contributions to the field of semiconductor technology, holding three patents that showcase his innovative approach to device packaging.
Latest Patents
His latest patents include a semiconductor device package that features a substrate, a connection structure, a first package body, and a first electronic component. The substrate has a first surface and a second surface opposite to the first surface. The connection structure is disposed on the first surface of the substrate. The first package body is placed on the first surface of the substrate, covering the connection structure while exposing a portion of it. The first electronic component is then positioned on the first package body, making contact with the exposed portion of the connection structure. Another patent details a similar semiconductor device package and method of manufacturing the same, emphasizing the innovative design and functionality of the components involved.
Career Highlights
Chih-Fang Wang is currently employed at Advanced Semiconductor Engineering, Inc., where he continues to develop cutting-edge technologies in semiconductor packaging. His work has been instrumental in advancing the efficiency and reliability of electronic components.
Collaborations
He collaborates with talented coworkers such as Shang-Ruei Wu and Chien-Yuan Tseng, contributing to a dynamic team focused on innovation in semiconductor technology.
Conclusion
Chih-Fang Wang's contributions to semiconductor device packaging reflect his expertise and commitment to innovation. His patents not only enhance the functionality of electronic devices but also pave the way for future advancements in the industry.