Chien-Feng Chan

Title: Innovations by Chien-Feng Chan

Introduction

Chien-Feng Chan is a notable inventor based in Taichung, Taiwan. He has made significant contributions to the field of semiconductor technology, holding a total of 4 patents. His work focuses on improving the fabrication processes and structures of semiconductor packages.

Latest Patents

One of his latest patents is titled "Method of fabricating a semiconductor structure having conductive bumps with a plurality of metal layers." This invention describes a conductive bump structure that is formed on a substrate with multiple bonding pads. The structure includes a first metal layer on the bonding pads, a second metal layer on the first, and a third metal layer on the second. The second metal layer has a higher melting point than the third, allowing for a thermal compression bonding process that prevents substrate cracking.

Another significant patent is the "Fabrication method of semiconductor package." This patent outlines a semiconductor package that includes a semiconductor chip with opposite surfaces and a redistribution layer (RDL) structure. The RDL structure is electrically connected to the chip and features conductive bumps embedded in an encapsulant. This design effectively prevents warpage and enhances electrical connections within the semiconductor package.

Career Highlights

Chien-Feng Chan is currently employed at Siliconware Precision Industries Co., Ltd. His work at this company has been instrumental in advancing semiconductor technologies and improving manufacturing processes.

Collaborations

He has collaborated with notable coworkers such as Chun-Tang Lin and Yi-Che Lai, contributing to various innovative projects in the semiconductor field.

Conclusion

Chien-Feng Chan's contributions to semiconductor technology through his patents and collaborations highlight his role as a key innovator in the industry. His work continues to influence advancements in semiconductor fabrication and packaging.