Chien-Chia Cheng

Title: Innovations of Chien-Chia Cheng in Semiconductor Technology

Introduction

Chien-Chia Cheng is a notable inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of semiconductor technology, particularly through his innovative patent. His work focuses on enhancing the efficiency and performance of semiconductor devices.

Latest Patents

Chien-Chia Cheng holds a patent titled "Fin bending reduction through structure design." This patent describes a method that involves etching a semiconductor substrate to create a trench between two semiconductor strips. The first semiconductor strip has a width of about 5 nm below its top, while the second strip has a width of about 60 nm below its top. The design ensures that the first width is smaller than 5 nm and the second width is smaller than 14.5 nm. The trench is filled with dielectric materials to form an isolation region, which is recessed to a specific depth. A top portion of the first semiconductor strip protrudes higher than the isolation region, forming a protruding fin with a height smaller than the depth. A gate stack is then formed to extend over the sidewall and top surface of the protruding fin.

Career Highlights

Chien-Chia Cheng is currently employed at Taiwan Semiconductor Manufacturing Company Limited, a leading firm in the semiconductor industry. His work at this company has allowed him to apply his innovative ideas and contribute to advancements in semiconductor manufacturing.

Collaborations

Chien-Chia Cheng has collaborated with notable colleagues, including De-Wei Yu and Ming-Feng Hsieh. These collaborations have further enriched his research and development efforts in the semiconductor field.

Conclusion

Chien-Chia Cheng's contributions to semiconductor technology through his innovative patent demonstrate his expertise and commitment to advancing the industry. His work continues to influence the development of more efficient semiconductor devices.