Chien-Chi Tzeng

Title: Innovations by Chien-Chi Tzeng

Introduction

Chien-Chi Tzeng is a notable inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of semiconductor packaging, holding a total of 3 patents. His work focuses on enhancing the efficiency and effectiveness of optical inspection systems and cleaning methods for package devices.

Latest Patents

One of Tzeng's latest patents is an "Automatic optical inspection system and method." This method involves forming a package component that includes an integrated circuit die. The process entails attaching the package component to a package substrate and placing a heat spreader over it to create an integrated circuit package. The height of this package is maintained between 2.5 mm and 6 mm. A first automatic optical inspection (AOI) process is then performed using an AOI apparatus to ensure the orientation and alignment of the heat spreader meet specifications. The apparatus features a lens with a maximum depth of field greater than the package height, allowing for comprehensive inspection.

Another significant patent is for "Apparatus and methods for cleaning a package." This invention provides an apparatus designed for cleaning package devices. It includes a package device loader and unloader, along with a first cleaning area situated between them. A conveyor system connects these components, featuring a movable upper surface that adjusts in height as it moves from the loader to the unloader, enhancing the cleaning process.

Career Highlights

Chien-Chi Tzeng is currently employed at Taiwan Semiconductor Manufacturing Company Limited, a leading firm in the semiconductor industry. His work has been instrumental in advancing packaging technologies, which are crucial for the performance of integrated circuits.

Collaborations

Throughout his career, Tzeng has collaborated with talented individuals such as Ying-Hao Wang and Chien-Lung Chen. These partnerships have fostered innovation and contributed to the successful development of his patented technologies.

Conclusion

Chien-Chi Tzeng's contributions to semiconductor packaging through his innovative patents demonstrate his expertise and commitment to advancing technology in this field. His work continues to influence the industry and improve the efficiency of semiconductor manufacturing processes.