Kaohsiung, Taiwan

Chieh-An Yeh

This inventor holds 1 USPTO granted patent and 2 published patent applications. Top assignee: Advanced Semiconductor Engineering, Inc.. Active years: 2022.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Chieh-An Yeh. Retrieved from https://idiyas.com/inventor/chieh-an-yeh

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 1 

% Patents Active = 100.0

Average Co-Inventor Count = 2.0

ph-index = 1


Company Filing History:


Years Active: 2022

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1 patent (USPTO):Explore Patents

Title: Chieh-An Yeh: Innovator in Semiconductor Technology

Introduction

Chieh-An Yeh is a prominent inventor based in Kaohsiung, Taiwan. He has made significant contributions to the field of semiconductor technology, particularly through his innovative patent.

Latest Patents

Chieh-An Yeh holds a patent for a "Stacked structure and method for manufacturing the same." This invention features a stacked structure that includes a polymer layer and a metal layer. The metal layer is disposed on the polymer layer, with a burr length on the surface of the polymer layer ranging from about 0.8 μm to about 150 μm. Additionally, the burr length on the surface of the metal layer is between about 0.8 μm to about 7 μm. This patent showcases his expertise in enhancing semiconductor manufacturing processes.

Career Highlights

Chieh-An Yeh is currently employed at Advanced Semiconductor Engineering, Inc., where he applies his knowledge and skills to advance semiconductor technologies. His work has been instrumental in developing innovative solutions that improve manufacturing efficiency and product quality.

Collaborations

Chieh-An Yeh collaborates with fellow inventor Tai-Hung Kuo, contributing to the advancement of semiconductor technologies through their combined expertise.

Conclusion

Chieh-An Yeh is a notable inventor whose work in semiconductor technology has led to valuable innovations. His patent reflects his commitment to improving manufacturing processes in the industry.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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