The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 17, 2022
Filed:
Oct. 31, 2019
Applicant:
Advanced Semiconductor Engineering, Inc., Kaohsiung, TW;
Inventors:
Chieh-An Yeh, Kaohsiung, TW;
Tai-Hung Kuo, Kaohsiung, TW;
Assignee:
ADVANCED SEMICONDUCTOR ENGINEERING, INC., Kaohsiung, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B81B 7/00 (2006.01); B81C 1/00 (2006.01);
U.S. Cl.
CPC ...
B81B 7/0064 (2013.01); B81C 1/0038 (2013.01); B81C 1/00047 (2013.01); B81C 1/00333 (2013.01); B81C 1/00492 (2013.01); B81B 2203/0315 (2013.01); B81C 2201/019 (2013.01);
Abstract
A stacked structure includes a polymer layer and a metal layer. The metal layer is disposed on the polymer layer. A burr length on a surface of the polymer layer is about 0.8 μm to about 150 μm, and a burr length on a surface of the metal layer is about 0.8 μm to about 7 μm.
Yeh, Chieh-An. (2022). Stacked structure and method for manufacturing the same (U.S. Patent No. 11332363). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11332363
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile