Hsin-Chu, Taiwan

Chiao-Chun Hsu

USPTO Granted Patents = 8 

Average Co-Inventor Count = 4.2

ph-index = 1

Forward Citations = 2(Granted Patents)


Company Filing History:


Years Active: 2021-2025

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8 patents (USPTO):

Title: Innovations of Chiao-Chun Hsu

Introduction

Chiao-Chun Hsu is a prominent inventor based in Hsin-Chu, Taiwan. He has made significant contributions to the field of semiconductor technology, holding a total of eight patents. His work focuses on enhancing the efficiency and functionality of semiconductor fabrication tools and microelectromechanical systems (MEMS).

Latest Patents

One of his latest patents is titled "Semiconductor tool having controllable ambient environment processing zones." This invention involves a semiconductor fabrication tool that includes a first heating plate and a second heating plate arranged vertically within a processing chamber. The design features two exhaust ports that communicate with the heating plates, allowing for precise control of exhaust pressure.

Another notable patent is "Self-aligned dielectric liner structure for protection in MEMS comb actuator." This patent describes a MEMS comb actuator that includes a support layer with protrusions made of a single material. The actuator is designed with a dielectric liner structure that protects the support layer and protrusions, enhancing the device's durability and performance.

Career Highlights

Chiao-Chun Hsu works at Taiwan Semiconductor Manufacturing Company Limited, a leading firm in the semiconductor industry. His innovative designs and patents have contributed to advancements in semiconductor manufacturing processes, making him a valuable asset to his company.

Collaborations

Chiao-Chun Hsu collaborates with Chung-Yi Yu, a fellow inventor, to further enhance their research and development efforts in semiconductor technologies.

Conclusion

Chiao-Chun Hsu's contributions to semiconductor technology through his patents demonstrate his expertise and innovative spirit. His work continues to influence the industry, paving the way for future advancements in semiconductor fabrication and MEMS technology.

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