Taipei, Taiwan

Chia-Yu Lin

USPTO Granted Patents = 13 

 

Average Co-Inventor Count = 1.5

ph-index = 1

Forward Citations = 6(Granted Patents)


Location History:

  • Taoyuan County, TW (2014)
  • New Taipei, TW (2014 - 2022)
  • Taipei, TW (2011 - 2023)

Company Filing History:


Years Active: 2011-2024

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13 patents (USPTO):

Title: Innovator Spotlight: Chia-Yu Lin - Master of Heat Dissipation Technology

Introduction: Chia-Yu Lin is a distinguished inventor based in Taipei, Taiwan. With an impressive portfolio featuring 13 patents, Lin is recognized for his contributions to heat dissipation technology, crucial in various electronic applications. His innovative designs aim to enhance the efficiency and performance of electronic devices.

Latest Patents: Among Chia-Yu Lin's latest inventions are two noteworthy patents: the "Heat Dissipation Device and Fin Structure" and the "Heat Dissipation Device." The fin structure patent encompasses a unique design that involves a main body and minor structures, facilitating improved airflow and heat transfer. The heat dissipation device patent details a system designed to maintain thermal contact with a heat source, featuring a heat dissipation body designed with vertical channels and a specialized cover plate that optimizes thermal conductivity.

Career Highlights: Lin has contributed significantly to the field of thermal management during his tenure with notable companies, including Cooler Master Co., Ltd. and Cooler Master Development Corporation. His work has led to significant advancements in technology that impact various industries where efficient heat management is crucial.

Collaborations: Throughout his career, Lin has worked alongside esteemed colleagues, including Chang-Yu Hsieh and Shan-Yin Cheng. Their collaborative efforts have been pivotal in driving innovation and pushing the boundaries of existing thermal management solutions.

Conclusion: Chia-Yu Lin stands out as a prolific inventor whose work in heat dissipation technology plays a vital role in enhancing the performance of modern electronic devices. His patents reflect a commitment to innovation that continues to inspire future advancements in thermal management systems.

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