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For the Inventor, By the Inventor

Taipei, Taiwan

Cooler Master Co., Ltd.


USPTO Granted Patents = 250

% Expired Patents = 10.0


Trademarks = 3

Forward Citations = 1,370

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161 inventors (with patents filed for the assignee):

goldMedal Shui-Fa Tsai (54 out of 58 patents)

silverMedal Shih-Wei Huang (18 out of 26 patents)

bronzeMedal Jen-Chih Cheng (17 out of 19 patents)

4.  Hsin-Hung Chen (16 out of 29 patents)

5.  Chien-Hung Sun (14 out of 15 patents)

6.  Shan-Yin Cheng (13 out of 13 patents)

7.  Lei-Lei Liu (13 out of 13 patents)

8.  Tsung-Wei Lin (12 out of 22 patents)

9.  Fu-Lung Lin (11 out of 12 patents)

10.  Wen-Hsien Lin (9 out of 11 patents)

11.  Chu-Yi Kuo (7 out of 7 patents)

12.  Chang-Han Tsai (7 out of 9 patents)

13.  Chia-Hao Sung (6 out of 8 patents)

14.  Chang-Hung Peng (6 out of 6 patents)

15.  Chia-Chun Cheng (6 out of 8 patents)


Core Competencies:
Liquid Pump Unit
Vapor Chamber
Heat Dissipation Device
Cooling Apparatus
Multi-Channel Heat Exchanger
Immersion Cooling
Fan Assembly
Heat Sink
Liquid Cooling System
Thin Pump
Radiator
Heat Exchanger Fin

250 patents:

1. 12516667 - Liquid pump unit with latch mechanism (2026-01-06),
2. 12504235 - Vapor chamber heatsink assembly (2025-12-23),
3. 12474126 - Heat dissipation device having irregular shape (2025-11-18),
4. 12426204 - Liquid cooling pumping unit (2025-09-23),
5. 12408306 - Liquid cooled server chassis (2025-09-02),
6. 12405417 - Light emitting multi fan device (2025-09-02),
7. 12402272 - Single-phase immersion cooling system and method of the same (2025-08-26),
8. 12392564 - Multi-channel thin heat exchanger and manufacturing method of the same (2025-08-19),
9. 12392348 - Fan assembly (2025-08-19),
10. 12369276 - Storage assembly and heat dissipation device (2025-07-22),
11. 12345473 - Vapor chamber (2025-07-01),
12. 12336153 - Two-phase immersion cooling apparatus (2025-06-17),
13. 12331997 - Heat dissipation device having irregular shape (2025-06-17),
14. 12281849 - Heat dissipation device (2025-04-21),
15. 12193190 - Heat sink and heat dissipation device (2025-01-07),
Company Overview
Cooler Master Co., Ltd., headquartered in Taipei, Taiwan, specializes in advanced liquid cooling technology for computing systems. The company is recognized for its innovative solutions in heat management, including liquid pump units, vapor chambers, and multi-channel heat exchangers. Cooler Master focuses on enhancing thermal performance through products like cooling apparatuses, fan assemblies, and heat sinks. Its commitment to research and development positions it as a leader in the cooling technology sector, catering to both gaming and professional markets.
Profile summary synthesized from public USPTO records and patent filings.

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USPTO Data Jan 1 1976 - Oct 13 2026

250 Patents

#19 in Taipei

#116 in Taiwan

#3,484 in the World

Taipei, TW
Taipei, Taiwan

Cooler Master Co., Ltd.

Forward Citations = 1,370

161 inventors:

goldMedal Shui-Fa Tsai (54 out of 58 patents)

silverMedal Shih-Wei Huang (18 out of 26 patents)

bronzeMedal Jen-Chih Cheng (17 out of 19 patents)

4.  Hsin-Hung Chen (16 out of 29 patents)

5.  Chien-Hung Sun (14 out of 15 patents)

IDiyas Innovation Intelligence. (2026). Company Patent Portfolio: Cooler Master Co., Ltd.. Retrieved from https://idiyas.com/company/cooler-master-company

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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