Taipei, Taiwan

Tsung-Wei Lin

This inventor holds 22 USPTO granted patents and 4 published patent applications and 1 EPO patent, primarily in Liquid Cooling Technologies. Top assignees: Cooler Master Co., Ltd., Corel Corporation, Ulead Systems, Inc.. Active years: 1998-2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Tsung-Wei Lin. Retrieved from https://idiyas.com/inventor/tsung-wei-lin

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 22 

% Patents Active = 81.8


Average Co-Inventor Count = 1.6

ph-index = 5

Forward Citations = 59(Granted Patents)


Location History:

  • Mountain View, CA (US) (2014)
  • Taipei, TW (1998 - 2024)
  • New Taipei, TW (2018 - 2024)

Company Filing History:


Years Active: 1998-2025

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Areas of Expertise:
Liquid Cooling
Heat Dissipation
Fan Design
Server Chassis
Water Cooling
Cooling Device
Image Processing
Display Methods
Fan Impeller
Modular Blade
Leak Detection
3D Rendering
22 patents (USPTO):Explore Patents

Title: Innovator of Liquid Cooling Technologies: Tsung-Wei Lin

Introduction: Tsung-Wei Lin is a prominent inventor based in Taipei, Taiwan, known for his innovative contributions in the field of thermal management and liquid-cooling technologies. With a remarkable portfolio of 20 patents, Tsung-Wei has positioned himself as a leading figure in the development of efficient heat dissipation solutions.

Latest Patents: Among his most recent inventions are two noteworthy patents that illustrate his expertise in liquid cooling technology. The first patent, titled "Liquid-Cooling Heat Dissipation Device," presents a sophisticated design featuring a base with a first inlet and outlet, complemented by two pumps arranged in a parallel configuration. This innovative setup ensures effective heat dissipation for various applications.

The second patent, "Liquid Cooling Device and Electronic Device," expands on these concepts, integrating a first and second heat exchanger, a heat dissipation component, and a fluid driving component. This intricate design facilitates optimal thermal management, allowing for efficient operation of electronic devices with increased reliability.

Career Highlights: Tsung-Wei Lin has worked with renowned companies, including Cooler Master Co., Ltd. and Ulead Systems, Inc. His experience in these organizations has greatly contributed to his knowledge and skills in thermal technology innovations, enabling him to push the boundaries of existing solutions.

Collaborations: Throughout his career, Tsung-Wei has collaborated with noted professionals such as Shui-Fa Tsai and Fu-Lung Lin. These partnerships have fostered an environment of creativity and innovation, resulting in breakthroughs in the thermal management sector.

Conclusion: Tsung-Wei Lin continues to be a driving force in the realm of liquid cooling technologies. His dedication to improving heat dissipation systems through innovative designs not only enhances the performance of electronic devices but also exemplifies the spirit of invention and advancement in contemporary technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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