Cooler Master Co., Ltd.

Cooler Master Development Corporation

Taiwan Glass Industry Corp.

National Taiwan University

Tung Thih Electronic Co., Ltd.

Chia-Yu Lin

Chih-Kung Lee

Wen-Jong Wu

Shan-Yin Cheng

Chang-Yu Hsieh

Hsiang-Fen Chou

Chuin-Shan Chen

Chih-Chiang Cheng

Wen-Hsin Hsiao

Chiun-Hua Chang

Pei-Zen Chang

Tzu-Chin Tsai

Shih-Feng Lee

Jen-Hsuan Ho

Jay Shieh

Yen Tsai

Chien-Ting Liu

This disclosure relates to a fin structure including a main body and at least one minor structure. The main body includes a main plate and two side plates. The main plate has at least one through hole. The two side plates are respectively connected to two opposite sides of the main plate and protrude from the main plate. The at least one minor structure protrudes from the main plate and is located at a side of the main plate. The at least one minor structure is spaced apart from the two side plates. The at least one minor structure partially covers the at least one through hole. The at least one minor structure has a length, in a longitudinal direction of the main plate, less than a length of the at least one through hole of the main plate.

Heat dissipation device and fin structure

This disclosure provides a heat dissipation device configured to be in thermal contact with a heat source. The heat dissipation device includes a heat dissipation body and a cover plate. The heat dissipation body has at least one vertical channel. The heat dissipation body is configured to be in thermal contact with the heat source. The cover plate includes a first layer and a second layer that are stacked on each other. The first layer is stacked on the heat dissipation body and covers the at least one vertical channel. A thermal conductivity of the first layer is larger than a thermal conductivity of the second layer. The cover plate has at least one first through hole penetrating through the first layer and the second layer and connecting to the at least one vertical channel.

Heat dissipation device

A glass material with a low dielectric constant and a low fiberizing temperature includes silicon dioxide, boron trioxide, aluminum oxide, calcium oxide, phosphorus pentoxide and zinc oxide. The silicon dioxide makes up 45%-52% by weight of the glass material. The boron trioxide makes up 25%-30% by weight of the glass material. The aluminum oxide makes up 10%-14% by weight of the glass material. The calcium oxide makes up 1%-4% by weight of the glass material. The phosphorus pentoxide makes up 0-3% by weight of the glass material. The zinc oxide makes up 1%-5% by weight of the glass material. The reduced silicon dioxide content and calcium oxide content and addition of phosphorus pentoxide and zinc oxide in the glass material lower the dielectric constant and fiberizing temperature of the glass material.

Glass material with low dielectric constant and low fiberizing temperature

A glass material with a low dielectric constant attributable to a high weight percentage of boron trioxide includes at least one component for forming the main constructure of the glass material, a fluxing component, a reinforcing component, and a modifier; wherein the at least one component for forming the main constructure of the glass material includes silicon dioxide (SiO); the fluxing component includes boron trioxide (BO); the reinforcing component includes aluminum oxide (AlO); and the modifier includes calcium oxide (CaO). The glass material is characterized in that it has a boron trioxide (BO) content by weight of 30%-40%, which is higher than those in the prior art; a calcium oxide (CaO) content by weight of 1%-6%, which is lower than those in the prior art; and consequently a lower dielectric constant and a lower dissipation factor of the glass material than those in the prior art can be obtained.

Glass material with low dielectric constant attributable to high weight percentage of boron trioxide

A glass material with low viscosity and a low bubble content attributable to a low weight percentage of silicon dioxide includes boron trioxide (BO), magnesium oxide (MgO), aluminum oxide (AlO), and calcium oxide (CaO) in addition to silicon dioxide (SiO); wherein Silicon dioxide (SiO) constitutes 45%-51% by weight of the glass material, boron trioxide (BO) 25%-35%, magnesium oxide (MgO) 0.01%-2%, aluminum oxide (AlO) 10%-14.5%, and calcium oxide (CaO) 4%-10%. As the silicon dioxide (SiO) content is lower than in the prior art, the glass material has lower viscosity, and hence a lower bubble content, than in the prior art, and this allows products made of the glass material to have a higher yield than products made of the conventional glass.

Glass material with low viscosity and low bubble content attributable to low weight percentage of silicon dioxide

A heat dissipating device includes a base and a plurality of heat dissipating fins. The base includes a substrate and a box, wherein the substrate and the box are formed integrally and the box has an accommodating space therein. Each of the heat dissipating fins includes a heat dissipating portion, a fixing portion and an overflow-proof structure. The fixing portion is fixed in the base. The overflow-proof structure is connected between the heat dissipating portion and the fixing portion. A width of the overflow-proof structure is larger than a width of the heat dissipating portion and larger than a width of the fixing portion.

Heat dissipating device

A heat dissipating device includes a heat dissipating fin module, a second base, a third base, a heat pipe, a first sleeve and a fourth base. The heat dissipating fin module includes a first base and a plurality of first heat dissipating fins. A recess is formed on the second base. The third base is disposed in the recess. The heat pipe includes a heat dissipating segment, a heat absorbing segment and a connecting segment connecting the heat dissipating segment and the heat absorbing segment. The heat dissipating segment is disposed in the first base. The heat absorbing segment is disposed in the second and third bases and contacts the third base directly. The first sleeve at least covers the connecting segment. The fourth base is formed by a die casting process and covers peripheries of the first and second bases and the first sleeve.

A heat dissipating device includes a base, a heat dissipating fin and a protruding member. The heat dissipating fin includes a heat dissipating portion, a fixing portion fixed in the base, and a first overflow-proof structure. The first overflow-proof structure is connected between the heat dissipating portion and the fixing portion. A width of the first overflow-proof structure is larger than a width of the heat dissipating portion. A first hole is formed on the heat dissipating portion and the first overflow-proof structure. The protruding member includes a second overflow-proof structure and a first protruding portion protruding from an upper surface of the second overflow-proof structure. The protruding member is disposed in the first hole, and a lower surface of the second overflow-proof structure and a lower surface of the first overflow-proof structure are coplanar.

An ultrasonic sensor device includes a housing, a circuit board disposed at the housing, and a transducer. The transducer includes an electrically conductive casing having a bottom wall and a surrounding wall. A piezoelectric member is disposed on top of the bottom wall. A first connecting pin set is disposed in the housing, and includes a first connecting pin having one end connected to the circuit board and another end connected to the piezoelectric member, and a second connecting pin having one end connected to the circuit board and another end connected to the surrounding wall. A second connecting pin set is disposed in the housing, has one end connected to the circuit board, and another end extended into a connecting portion of the housing.

Ultrasonic sensor device

An ultrasonic distance-measuring sensor assembly and an ultrasonic distance-measuring sensor thereof are disclosed. The ultrasonic distance-measuring sensor includes at least two piezoelectric actuators and a member. The member includes a side wall, at least two vibration generating/receiving surfaces and a partition. The vibration generating/receiving surfaces accommodate the piezoelectric actuators as sources. The side wall surrounds the vibration generating/receiving surfaces. The partition is disposed between the vibration generating/receiving surfaces and includes a slot. The slot is disposed between the vibration sending/receiving surfaces.

Ultrasonic distance-measuring sensor with gap and partition between vibrating surfaces

An ultrasound transducer has a cup-shaped casing. The cup-shaped casing has a sidewall. A cross section of an inner surface of the sidewall being perpendicular to a central axis of the ultrasound transducer substantially shows a dumbbell-shaped contour. The dumbbell-shaped contour has a pair of opposite straight-line sections being substantially parallel to a longitudinal axis of the dumbbell-shaped contour and a pair of opposite arc sections being located respectively at two ends of the longitudinal axis of the dumbbell-shaped contour and respectively forming two enlarged portions of the dumbbell-shaped contour. Two ends of each arc section of the dumbbell-shaped contour respectively joint the straight-line sections through two curve sections and each curve section is connected to one end of the arc section and one straight-line section. At least one enlarged area of a dumbbell-shaped surface of an inside bottom surface has a recessed portion.

Growing community of inventors

Taipei, Taiwan

Chia-Yu Lin