Chia-Wei Hsu

Title: Innovations by Inventor Chia-Wei Hsu

Introduction

Chia-Wei Hsu is a notable inventor based in Kaohsiung, Taiwan. He has made significant contributions to the field of semiconductor technology, holding a total of three patents. His innovative methods focus on enhancing the manufacturing processes of fins used in various electronic applications.

Latest Patents

One of Hsu's latest patents is a method of cutting fins. This method involves providing a photomask with a snake-shaped pattern, forming a photoresist layer over fins on a substrate, and then creating a photoresist pattern that corresponds to the photomask. The fins are subsequently cut by transferring the photoresist pattern and etching the designated parts. Another significant patent is a method of rounding corners of a fin. This process includes providing a substrate with a fin, covering it with a pad oxide and pad nitride, and later removing part of the pad oxide to expose the fin's top surface. A silicon oxide layer is then formed to contact the fin's sidewalls and top surface, followed by an annealing process to round the corners.

Career Highlights

Chia-Wei Hsu has worked with prominent companies in the semiconductor industry, including United Microelectronics Corporation and Linkx Electronics Co., Ltd. His experience in these organizations has allowed him to develop and refine his innovative techniques.

Collaborations

Hsu has collaborated with notable coworkers such as Wen-Chen Wei and Wei-Hao Huang, contributing to advancements in their respective fields.

Conclusion

Chia-Wei Hsu's contributions to semiconductor technology through his innovative patents demonstrate his expertise and commitment to advancing the industry. His work continues to influence the development of electronic components, showcasing the importance of innovation in technology.