Company Filing History:
Years Active: 2022
Title: Chia-Peng Sun: Innovator in Underfill Package Technology
Introduction
Chia-Peng Sun is a notable inventor based in Zhubei, Taiwan. He has made significant contributions to the field of underfill package technology, holding a total of 2 patents. His work focuses on improving the reliability and performance of electronic components through innovative measurement methods.
Latest Patents
Chia-Peng Sun's latest patents include two groundbreaking methods. The first patent, titled "Method of measuring voids in underfill package," provides a comprehensive approach to measuring voids in underfill materials. This method involves obtaining a welding angle profile, simulating a void profile, and determining high-risk void regions to ensure the underfill package meets required standards. The second patent, "Method of measuring underfill profile of underfill cavity having solder bumps," outlines a method for measuring the underfill profile in cavities with solder bumps. This method calculates reference forces and flow speeds to obtain accurate volume fractions, ultimately determining the underfill profile.
Career Highlights
Chia-Peng Sun is currently employed at Coretech System Co., Ltd., where he continues to develop innovative solutions in the field of underfill technology. His expertise and dedication have positioned him as a key player in advancing electronic packaging methods.
Collaborations
Chia-Peng Sun collaborates with talented colleagues, including Chih-Chung Hsu and Rong-Yeu Chang. Their combined efforts contribute to the ongoing development of cutting-edge technologies in their field.
Conclusion
Chia-Peng Sun's contributions to underfill package technology through his innovative patents demonstrate his commitment to enhancing electronic component reliability. His work continues to influence the industry positively.