The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 07, 2022
Filed:
Jul. 21, 2021
Coretech System Co., Ltd., Zhubei, TW;
Yu-En Liang, Zhubei, TW;
Chia-Peng Sun, Zhubei, TW;
Chih-Chung Hsu, Zhubei, TW;
Rong-Yeu Chang, Zhubei, TW;
Chia-Hsiang Hsu, Zhubei, TW;
CORETECH SYSTEM CO., LTD., Zhubei, TW;
Abstract
The present disclosure provides a method for measuring an underfill profile of an underfill material in an underfill cavity having a plurality of solder bumps. The method includes the operations of: determining a mesh having a plurality of elements according to the underfill cavity; calculating a reference force according to the underfill cavity; obtaining a driving force and a flow speed of the underfill material according to a plurality of weighting factors and the reference force, wherein the plurality of weighting factors respectively correspond to the plurality of elements; obtaining a plurality of volume fractions respectively corresponding to the plurality of elements according to the flow speed; and obtaining the underfill profile according to the plurality of volume fractions.