Yu-En Liang

Title: Yu-En Liang: Innovator in Underfill Measurement Technology

Introduction

Yu-En Liang is a notable inventor based in Zhubei, Taiwan. She has made significant contributions to the field of underfill measurement technology, particularly in the context of electronic packaging. Her innovative approach has led to the development of a unique method that enhances the accuracy of underfill profile measurements.

Latest Patents

Yu-En Liang holds a patent titled "Method of measuring underfill profile of underfill cavity having solder bumps." This patent outlines a method for measuring the underfill profile of an underfill material in a cavity that contains multiple solder bumps. The method involves several key operations, including determining a mesh with multiple elements based on the underfill cavity, calculating a reference force, and obtaining a driving force and flow speed of the underfill material. The process also includes obtaining volume fractions corresponding to the elements and ultimately deriving the underfill profile from these fractions. She has 1 patent to her name.

Career Highlights

Yu-En Liang is associated with Coretech System Co., Ltd., where she applies her expertise in underfill measurement technology. Her work has been instrumental in advancing the methodologies used in the industry, ensuring better performance and reliability in electronic components.

Collaborations

Yu-En Liang has collaborated with notable colleagues, including Chia-Peng Sun and Chih-Chung Hsu. These collaborations have fostered a productive environment for innovation and development in their respective fields.

Conclusion

Yu-En Liang's contributions to underfill measurement technology exemplify her commitment to innovation and excellence. Her patent and collaborative efforts continue to influence the industry positively.