The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 06, 2022
Filed:
Dec. 29, 2021
Coretech System Co., Ltd., Zhubei, TW;
Chien-Ting Wu, Zhubei, TW;
Ching-Kai Chou, Zhubei, TW;
Kai-Yi Bai, Zhubei, TW;
Wei-Yu Lin, Zhubei, TW;
Li-Hsuan Shen, Zhubei, TW;
Chia-Peng Sun, Zhubei, TW;
Chih-Chung Hsu, Zhubei, TW;
Rong-Yeu Chang, Hsinchu, TW;
Chia-Hsiang Hsu, Zhubei, TW;
CORETECH SYSTEM CO., LTD., Zhubei, TW;
Abstract
The present disclosure provides a method of measuring a plurality of voids in an underfill material of an underfill package. The method includes operations of obtaining a welding angle profile of the underfill package; obtaining a simulated void profile of the underfill package according to the welding angle profile; determining a plurality of high-risk void regions according to the simulated void profile; simulating, according to a selected pressure and a selected temperature of the underfill material, a first high-risk void region of the plurality of high-risk void regions to generate an updated void profile; and determining whether the updated void profile meets a void requirement of the underfill package.