Coretech System Co., Ltd.

Chia-Peng Sun

Chia-Hsiang Hsu

Rong-Yeu Chang

Chih-Chung Hsu

Li-Hsuan Shen

Wei-Yu Lin

Chien-Ting Wu

Ching-Kai Chou

Yu-En Liang

Kai-Yi Bai

The present disclosure provides a method of measuring a plurality of voids in an underfill material of an underfill package. The method includes operations of obtaining a welding angle profile of the underfill package; obtaining a simulated void profile of the underfill package according to the welding angle profile; determining a plurality of high-risk void regions according to the simulated void profile; simulating, according to a selected pressure and a selected temperature of the underfill material, a first high-risk void region of the plurality of high-risk void regions to generate an updated void profile; and determining whether the updated void profile meets a void requirement of the underfill package.

Method of measuring voids in underfill package

The present disclosure provides a method for measuring an underfill profile of an underfill material in an underfill cavity having a plurality of solder bumps. The method includes the operations of: determining a mesh having a plurality of elements according to the underfill cavity; calculating a reference force according to the underfill cavity; obtaining a driving force and a flow speed of the underfill material according to a plurality of weighting factors and the reference force, wherein the plurality of weighting factors respectively correspond to the plurality of elements; obtaining a plurality of volume fractions respectively corresponding to the plurality of elements according to the flow speed; and obtaining the underfill profile according to the plurality of volume fractions.

Method of measuring underfill profile of underfill cavity having solder bumps

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Zhubei, Taiwan

Chia-Peng Sun