Chia Kuei Hsu

Title: The Innovative Contributions of Chia Kuei Hsu

Chia Kuei Hsu is a notable inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of semiconductor packaging. His work focuses on enhancing chip package structures, which are crucial for modern electronic devices.

Latest Patents

Chia Kuei Hsu holds a patent for a "Method for forming chip package structure." This innovative chip package structure includes a wiring substrate and an interposer substrate positioned above it. The interposer substrate features a redistribution structure, a dielectric layer, a conductive via, and several first dummy vias. The dielectric layer is situated over the redistribution structure, while the conductive via and first dummy vias pass through the dielectric layer. The first dummy vias are designed to surround the conductive via and are electrically insulated from the wiring substrate. Additionally, the chip structure is placed over the interposer substrate and is electrically connected to the conductive via, ensuring insulation from the first dummy vias.

Career Highlights

Chia Kuei Hsu is currently employed at Taiwan Semiconductor Manufacturing Company Limited, a leading firm in the semiconductor industry. His work at this prestigious company has allowed him to contribute to advancements in chip packaging technology.

Collaborations

Chia Kuei Hsu has collaborated with notable colleagues, including Chin-Hua Wang and Shu-Shen Yeh. Their combined expertise has fostered innovation in semiconductor technologies.

Conclusion

Chia Kuei Hsu's contributions to the field of semiconductor packaging through his innovative patent demonstrate his significant role in advancing technology. His work continues to impact the industry positively.