Chia-Jen Chou

Title: Chia-Jen Chou: Innovator in Semiconductor Packaging

Introduction

Chia-Jen Chou is a notable inventor hailing from Hsinchu County, Taiwan. With an impressive portfolio of five patents, he has made significant contributions to the field of semiconductor packaging. His work demonstrates a commitment to innovation and technological advancement in an essential industry.

Latest Patents

One of Chou's latest patents is the "Package method of a modular stacked semiconductor package." This innovative method involves providing a carrier and multiple chip modules, stacking them on corresponding device areas, and creating electrical connections among them. A molding compound encapsulates the chip modules and ensures quality connectivity, enhancing performance despite potential positioning errors.

Another of his notable patents is the "Semiconductor device package with a stress relax pattern." This design incorporates a unique pattern of dielectric material on the active surface of the die, surrounded by multiple metal contacts. The patent emphasizes the advantage of selecting materials with different properties, such as Young's modulus and thermal expansion coefficients, to improve the overall reliability and efficacy of semiconductor devices.

Career Highlights

Chia-Jen Chou currently works with Powertech Technology Inc., a leading firm in semiconductor packaging and testing solutions. His expertise and innovative mindset have allowed him to be a part of key developments within the company and contribute to groundbreaking advancements in semiconductor technology.

Collaborations

Throughout his career, Chou has collaborated with talented peers, including Ting-Feng Su and Yong-Cheng Chuang. Together, they have worked on various projects aimed at advancing semiconductor packaging technologies, resulting in significant innovations that benefit the industry.

Conclusion

Chia-Jen Chou stands out as an accomplished inventor within the semiconductor industry. With multiple patents regarding improved semiconductor packaging methods, he continues to lead the way in technological innovation. His work exemplifies how dedicated inventors can drive progress and enhance the capabilities of modern technology.