Chia-Hung Liu

Title: Innovations of Chia-Hung Liu in Semiconductor Technology

Introduction

Chia-Hung Liu is a prominent inventor based in Taichung, Taiwan. He has made significant contributions to the field of semiconductor technology, holding a total of four patents. His work focuses on methods for forming semiconductor structures, which are crucial for the advancement of electronic devices.

Latest Patents

Chia-Hung Liu's latest patents include innovative methods for forming semiconductor structures. One of his patents describes a method that involves providing a semiconductor substrate, forming a sacrificial layer over it, and etching the sacrificial layer to create a sacrificial pattern. This pattern is then used as an etching mask to form an active region of the semiconductor substrate. The process includes trimming the sacrificial pattern and replacing it with a gate electrode. Another patent outlines a similar method, emphasizing the importance of these techniques in enhancing semiconductor fabrication.

Career Highlights

Chia-Hung Liu is currently employed at Winbond Electronics Corporation, where he continues to develop cutting-edge technologies in semiconductor manufacturing. His expertise and innovative approaches have positioned him as a key figure in the industry.

Collaborations

Chia-Hung Liu has collaborated with notable colleagues, including Tzu-Ming Ou Yang and Shu-Ming Lee. Their combined efforts contribute to the advancement of semiconductor technologies and the successful implementation of innovative solutions.

Conclusion

Chia-Hung Liu's contributions to semiconductor technology through his patents and work at Winbond Electronics Corporation highlight his role as an influential inventor in the field. His innovative methods are paving the way for future advancements in electronic devices.