The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 04, 2022
Filed:
Dec. 10, 2019
Applicant:
Winbond Electronics Corp., Taichung, TW;
Inventors:
Assignee:
Winbond Electronics Corp., Taichung, TW;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/528 (2006.01); H01L 21/311 (2006.01); H01L 21/768 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5283 (2013.01); H01L 21/31116 (2013.01); H01L 21/76804 (2013.01); H01L 21/76897 (2013.01);
Abstract
A semiconductor device and a manufacturing method of the same are provided. The semiconductor device includes a substrate having a plurality of active regions, at least one dielectric layer formed on the substrate, and a plurality of contacts disposed in the dielectric layer and contacting with the active regions. The contact is a barrel-shaped structure with a middle portion, a head portion having a perimeter small than that of the middle portion, and an end portion having a perimeter small than that of the middle portion.