Chia-Hsing Wu

Title: Chia-Hsing Wu: Innovator in Three-Dimensional Integrated Circuits

Introduction

Chia-Hsing Wu is a prominent inventor based in Taipei, Taiwan. He has made significant contributions to the field of integrated circuits, particularly in the development of three-dimensional structures that enhance performance and efficiency. With a total of 2 patents, his work is recognized for its innovative approach to semiconductor technology.

Latest Patents

Wu's latest patents include a method for fabricating three-dimensional integrated circuits. This method involves several steps, starting with the formation of transistors over a substrate. An interconnect structure is then created over the first transistors, followed by the application of a dielectric layer. The process continues with the formation of 2D semiconductor seeds on the dielectric layer, which are subsequently annealed. An epitaxy process is performed to laterally grow multiple 2D semiconductor films from these seeds. Finally, second transistors are formed on the 2D semiconductor films, resulting in a sophisticated integrated circuit structure.

Career Highlights

Throughout his career, Chia-Hsing Wu has worked with notable organizations, including Taiwan Semiconductor Manufacturing Company and National Yang Ming Chiao Tung University. His experience in these institutions has allowed him to collaborate with leading experts in the field and contribute to groundbreaking research and development.

Collaborations

Wu has had the opportunity to work alongside esteemed colleagues such as Chenming Hu and Shu-Jui Chang. These collaborations have further enriched his research and innovation efforts in the semiconductor industry.

Conclusion

Chia-Hsing Wu's contributions to the field of integrated circuits exemplify his dedication to innovation and excellence. His patents and collaborations reflect a commitment to advancing technology in meaningful ways.