This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignee: United Microelectronics Corp.. Active years: 2023.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2023
Title: The Innovative Contributions of Chia-He Cheng
Chia-He Cheng is a notable inventor based in Taichung, Taiwan. He has made significant contributions to the field of substrate processing technology. His work is characterized by a focus on enhancing the efficiency and effectiveness of substrate processing apparatuses.
Latest Patents
Chia-He Cheng holds a patent for a substrate processing apparatus equipped with a substrate scanner. This innovative apparatus includes a process station for processing a substrate and a cassette station integrated with the process station. It features a substrate carriage designed for transferring the substrate between the process station and the cassette station through a passage located at the interface between the two stations. Additionally, the apparatus is equipped with a substrate scanner that captures surface image data during the transportation of the substrate through the passage. This invention represents a significant advancement in substrate processing technology.
Career Highlights
Chia-He Cheng is currently employed at United Microelectronics Corporation, a leading company in the semiconductor industry. His work at this organization has allowed him to contribute to cutting-edge technologies and innovations in substrate processing.
Collaborations
Chia-He Cheng has collaborated with notable colleagues, including Hua-Wei Peng and Hsin-Hsu Lin. These collaborations have further enhanced his work and contributions to the field.
Conclusion
Chia-He Cheng's innovative work in substrate processing technology, particularly his patented apparatus, showcases his commitment to advancing the industry. His contributions are valuable to the ongoing development of efficient substrate processing solutions.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
