Taichung, Taiwan

Chia-He Cheng

This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignee: United Microelectronics Corp.. Active years: 2023.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Chia-He Cheng. Retrieved from https://idiyas.com/inventor/chia-he-cheng

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 1 

% Patents Active = 100.0

Average Co-Inventor Count = 9.0

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 2023

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1 patent (USPTO):Explore Patents

Title: The Innovative Contributions of Chia-He Cheng

Chia-He Cheng is a notable inventor based in Taichung, Taiwan. He has made significant contributions to the field of substrate processing technology. His work is characterized by a focus on enhancing the efficiency and effectiveness of substrate processing apparatuses.

Latest Patents

Chia-He Cheng holds a patent for a substrate processing apparatus equipped with a substrate scanner. This innovative apparatus includes a process station for processing a substrate and a cassette station integrated with the process station. It features a substrate carriage designed for transferring the substrate between the process station and the cassette station through a passage located at the interface between the two stations. Additionally, the apparatus is equipped with a substrate scanner that captures surface image data during the transportation of the substrate through the passage. This invention represents a significant advancement in substrate processing technology.

Career Highlights

Chia-He Cheng is currently employed at United Microelectronics Corporation, a leading company in the semiconductor industry. His work at this organization has allowed him to contribute to cutting-edge technologies and innovations in substrate processing.

Collaborations

Chia-He Cheng has collaborated with notable colleagues, including Hua-Wei Peng and Hsin-Hsu Lin. These collaborations have further enhanced his work and contributions to the field.

Conclusion

Chia-He Cheng's innovative work in substrate processing technology, particularly his patented apparatus, showcases his commitment to advancing the industry. His contributions are valuable to the ongoing development of efficient substrate processing solutions.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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